Copper Oxide

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Copper Oxide powder - copper content 78-80%
  1. Supplementary source of copper in electroplating process of PCB or Semiconductor, The PCB HDI process is major application.
  2. Ceramic color mixing
  3. Wood Preservation
  4. Firecrackers raw materials
  5. Plating Grade
Specification Unit : ppm
Specification CuO Ni Fe Sn Pb Zn Cl Acid insoluble Moisture Content Dissolving speed
≧99% ≦10 ≦30 ≦10 ≦5 ≦30 ≦15 ≦30 ≦0.5% ≦30 sec.
Analysis
Result 		99.95% 1.28 4.82 N.D N.D 5.22 N.D 10 0.30% 18 sec.